The topics of interest for submission include, but are not limited to:
◕ Microelectronic Device Design and Manufacturing - Innovative design of semiconductor materials and devices - High performance and low power circuit design - Application of miniaturization and integration technology in advanced devices - Optimization of Electronic Device Manufacturing Processes |
◕ Characterization and Application of Nanomaterials - Preparation, characterization and property analysis of nanomaterials - Application of nanostructures in catalysis, energy storage and environmental fields |
◕ Nanoelectronics - Applications of Quantum Dots, Nanowires and 2D Materials - Electron Transport Phenomena at the Nanoscale - Simulation and Modeling of Nanoscale Devices - Emerging Nanoelectronic Devices Status and Future Prospects |
◕ Advanced Packaging Technology - Design and Realization of 3D Packaging and System-in-Packaging - Thermal Management and PackagingMaterial Innovation - Application of Nanomaterials in PackagingTechnology - Packaging and Integration of Optoelectronic Devices - Reliability and Test Technology in Advanced PackagingPackaging and Integration of Optoelectronic Devices |
◕ Nanosensors and their applications - Development and Innovation of Nanosensor Technology - Nanosensor Applications in Environmental Monitoring and Safety Detection - Design and Clinical Applications of Biosensors - Design and Fabrication of Optical NanSensors - Development of Wireless and Flexible Nanosensors |